American tech major Google in an unprecedented move posted renders of its upcoming flagship smartphone, the Pixel 4. In a tweet couple of weeks ago, Google revealed the Pixel 4 rear design. It square camera module at the back which would house a dual rear camera setup.
“Well, since there seems to be some interest, here you go! Wait ’til you see what it can do,” said Google in the tweet.
Contrary to what Google’s plan might have been at the time, the leaks haven’t slowed down.
A case render of the Pixel 4 was spotted by GSM Arena on Monday. The image shows a substantial camera bump.
In previous leaks,the device was said to come in three colours, with an in-display fingerprint sensor, 3D face unlock module at the front, Qualcomm Snadragon 855 processor. It will run Google’s upcoming OS, the Android Q.
Some leaks also say that the device will have a thickness of 8.2mm, whereas the camera bump thickness will be 9.3mm. There are also talks of a ‘mint’ coloured model.
The Google Pixel 3, 3 XL, 3a and 3a XL complete the current line-up of Google smartphones. The Pixel 3 and 3 XL were launched last year with Snapdragon 845 SoC, up to 4GB RAM and a class-leading 12.2MP Sony IMX 363 sensor.
The Pixel 3a and 3a XL were launched this year with the same camera, but stripped down processor and other specifications.